From May 5 to 7, FIRSTACK will participate in SEMICON Southeast Asia 2026, a major semiconductor industry event in Asia, to discuss trends in power device testing and reliability verification with power semiconductor companies, research institutions, and industry partners from around the world.

At the exhibition, FIRSTACK centered its presentation around the core concept of “Building Reliable Connections Between Power Semiconductors and Systems: From Laboratory to Mass Production, From Devices to Wafers,” showcasing solutions for dual-pulse testing of power semiconductors, dynamic and static testing for mass production, dynamic bias reliability testing for SiC, and SiC wafer aging testing.

During the exhibition, FIRSTACK delivered a keynote speech titled “Challenges and Solutions of SiC Power Devices,” focusing on the reliability challenges of SiC power devices in new energy vehicle and AI applications, as well as testing solutions at the wafer and device levels.

The event attracted numerous industry clients and partners for discussions, further strengthening technical collaboration between FIRSTACK and the Southeast Asian semiconductor supply chain.

We would like to thank all customers, partners, and industry colleagues who visited the FIRSTACK booth.

Moving forward, FIRSTACK will continue to focus on the power semiconductor testing sector, driving the development of power device and system applications with smarter, more efficient solutions.

We look forward to seeing you at our next event!

Next: Nuremberg, Germany · PCIM EUROPE 2026