To address the testing needs of 3-level devices and overcome the challenges associated with testing them, Firstack has introduced the ME100D-AM-3L, a dynamic test system specifically designed for 3-level power devices.

• 6-Channel SiC Drivers
  Self-developed ASIC drivers with dead-timeout put, cross talk suppression, and Miller clamping functions. 
  The resistor switching and Q_g/Q_gs/Q_gd testing are supported.

   

• Focus on 3-level devices,  achieve full-bus testing
  By subjecting the devices to dynamic stress testing using bus voltages that exactly match those of the target application, we have significantly improved testing accuracy and device screening rates, thereby ensuring the reliability of the final product from the outset.

   

• New device architecture with  low parasitic inductance

  Parasitic inductance (device and fixture not included)< 15 nH.

• Flexible Configuration

  Supports testing of both two-level and three-level topology modules. 
  Supports contact resistance, Vth, single/double pulse, multi-pulse, and complementary pulse testing.